Wednesday, April 14, 2010

application and Manufacture

1) Designed several models of GSM Platform (2G, 2.5G and 2.75G), particularly on HW and RF design.2) Familiar with C development for ARM with Multi-ICE3) Supported and gave trainings to China customers and Korea IDH on RF simulation/design/test, Layout review, FTA/CTA application and Manufacture; 4) Solved all kinds of the customers’ issues. 5) Designed on customized projects, such as GSM module. Strong Leadership1) Led the application team that was cross-location (Shenzhen and Hong Kong) and cross-functional (RF, BB and SW), and helped the team become more customer driver and process focused.2) New team members recruitment and train-up3) Expanded the team’s range of effectiveness and guaranteed the projects to be finished on time and with high quality.4) Cooperated with marketing team for design-win, and worked together with platform creation team for technology transfer.
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1) Platform/Architecture design, work together with architecture team in USA2) RF system design, simulation and optimization3) Familiar with Agilent ADS, Matlab and kinds of test equipment 4) In IC validation stage, developed ATE tools (LabVIEW and VEE) based on “SPI” protocol for all ICs validation and sub-systems (RX, VCO, PA…) evaluation; in platform integration stage, developed RF PTE(in C/C++) to test kinds of RF cases in non-signaling mode; in Pre-FTA stage, developed ATE tools(in LabVIEW) for reference phone to test most kinds of RF performance.
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